Material processing solutions for integration into existing production lines.
Thousands of LaserLine modules, based on CO2 laser beam sources from LANG, scribe, cut and perforate packaging for food, as well as technical and medical products all over the world. Our customers value LaserLine modules because of their high reliability – even for applications that are more robust. LANG LaserLine modules can be configured to your requirements. As single or multiple beams with focusing heads or scanner units and in different laser strengths and wavelengths.
LaserLine WD
The LaserLine WD modules cut, scribe or perforate a broad range of materials economically. Special optics can turn a single beam into a multiple beam system, and the spacing can be adjusted to your needs.
LaserLine CW
LaserLine CW Module can be used to process many different materials in addition to films. Thanks to LANG high-speed technology, numerous applications can be performed across the running web or contours. Whether scribing, cutting, engraving, marking or perforation: with the LaserLine CW you can process a broad range of applications and even perform the most challenging tasks.
LaserLine WD
The LaserLine WD modules cut, scribe or perforate a broad range of materials economically. Special optics can turn a single beam into a multiple beam system, and the spacing can be adjusted to your needs.
LaserLine CW
LaserLine CW Module can be used to process many different materials in addition to films. Thanks to LANG high-speed technology, numerous applications can be performed across the running web or contours. Whether scribing, cutting, engraving, marking or perforation: with the LaserLine CW you can process a broad range of applications and even perform the most challenging tasks.
Contact
LANG LASER-System GmbH
Im Espach 3
88444 Ummendorf - Germany
Telefon +49 7351 3474-0
Fax +49 7351 3474-19
info@lang-laser.de
